Electronic Packaging and Interconnection Handbook

Table of contents

*CONTRIBUTORS

*PREFACE

*Chapter 1: Plastics, Elastomers, and Composites

*Chapter 2: Adhesives, Underfills, and Coatings

*Chapter 3: Thermal Management

*Chapter 4: Connector and Interconnection Technology

*Chapter 5: Solder Technologies for Electronic Packaging and Assembly

*Chapter 6: Packaging and Interconnection of Integrated Circuits

*Chapter 7: Hybrid Microelectronics and Multichip Modules

*Chapter 8: Chip Scale, Flip Chip, and Advanced Chip Packaging Technologies

*Chapter 9: Rigid and Flexible Printed Circuit Board Technology

*Chapter 10: Packaging of High-Speed and Microwave Electronic Systems

*INDEX