
Table of contents
Preface
Contributors
Dedication
Chapter 1: Printed Circuit History and Overview
Chapter 2: Development and Fabrication of IC Chips
Chapter 3: Packaging of IC Chips
Chapter 4: Laminates and Prepregs as Circuit Board Base Materials
Chapter 5: Printed Circuit Board Fabrication
Chapter 6: Package and Component Attachment and Interconnection
Chapter 7: Solder Materials and Processes for Electronic Assembly Fabrication
Chapter 8: Printed Wiring Board Cleaning
Chapter 9: Board Coating Materials and Processes
Chapter 10: Flexible and Rigid Flexible Fabrication
Chapter 11: Fabrication and Properties of Electronic Ceramics and Composites
Chapter 12: Hybrid Microelectronics and Multichip Module Technologies
Chapter 13: Environmental Considerations in Electronic Assembly Fabrication
Index
About the Editor
