Area Array Packaging Processes: for BGA, Flip Chip, and CSP

This expert monograph on area array packaging processes delivers concise coverage of leading-edge assembly and manufacturing methods. Featuring the manufacturing processes and equipment of today's state-of-the-art electronic packaging, clearly explained by a team of world-class professionals and researchers, Area Array Packaging Processes and Equipment details cost-effective manufacturing methods you won't find elsewhere. Look inside for:

* Expert information on key processes

* Cutting-edge, in-depth coverage of processes for each area array technology

* Data on flip chip materials, processes, assembly, and underfilling

* BGA and CSP rework solutions

* Detailed descriptions of die-attach methods, materials, and rework

* Coverage of liquid encapsulation equipment and processes and molding for area array packaging

* Discussions of cost, quality, reliability, cycling, tooling, failure mechanisms, productivity, and more